ТЕРМО ПАСТА 8gr., <=0.0087 C-in2/W

This Cooling paste is very heat conductive. It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance. The cooling paste ensures an outstanding heat conduction and dissipation. This allows you to run heavy programs without the motherboard getting overheated.

Features:

• High stability and reliability
• Suitable to be applied to CPU, UPS, inverter, chipset and other PC components
• Low thermal resistance, high conductivity for heat transfer

Moment beared temperature: -50-300 °C
Operating temperature: -30-280 °C
Specific gravity: ≥3.15
Thermal conductivity: ≥4.63W/m-k
Thermal impedance: ≤0.0087 °C-in²/W
Thixotropic index: 280 ± 10
Viscosity: 12500
Depth: 114 mm
Height: 14 mm
Width: 22 mm